M36L0R7060T1 Datasheet, PDF (18/22 Pages) STMicroelectronics – 128 Mbit (Multiple Bank, Multilevel, Burst) Flash memory and 64 Mbit (Burst) PSRAM, 1.8 V supply, multichip package

Package mechanical
6
Package mechanical
M36L0R7060T1, M36L0R7060B1
In order to meet environmental requirements, Numonyx offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
Figure 6.
TFBGA88 8 × 10 mm, 8 × 10 ball array - 0.8 mm pitch, package outline
D
D1
e
SE
E E2 E1
b
BALL "A1"
FE FE1
A
FD
SD
A2
A1
1. Drawing is not to scale.
ddd
BGA-Z42
18/22