PC8374L Datasheet, PDF (5/239 Pages) National Semiconductor (TI) – SensorPathTM SuperI/O with Glue Functions

Winbond Electronics Corp. Advanced PC Product Center
Revision Record (Continued)
Revision Date
August 12, 2003
October 13, 2003
November 20, 2003
February 3, 2004
May 2004
Status
Draft Revision 0.7
Draft Revision 0.8
Preliminary Revision 0.9
Preliminary Revision 1.0
Preliminary Revision 1.1
Comments
Change PWRGD_3V functionality
Add details to SERIAL PORT 2 (SP2) WITH INFRARED Section
Change in HMSMBCF register
Typos and clarifications
Health Management: Added support for more LMxx devices - see
overview Section 9.2.2 - added a table of temp channel
association. New HM registers: Status Register 3-4, Monitoring
Control, Extended FANPWM Control 1-2, Tachometer Monitoring
Control, Channels Vdd configuration, Temp Critical Limit Zone1-
3,Temp Zone1-3 Gain and Offset Correction. New HM LPC
registers:HMINT_STS3, HMINT_EN#, HMSENS_STS3,
HMS_EN1-3, SMI/SCI_ROUT. Functional description updated.
Temp Reading registers updated.
Maximum PWM duty cycle,
Fans setting time to the maximum duty cycle,
Changed default mode of LED control
Correct Table 3 on page 18
Rename LMxx sensor device
Removed FPRST
Changed reset value of FANTACH registers to FF
Changed reset value of FANOFF to 1
Added Package Thermal Information
Typos and clarifications
● _{Changes to the Health Management Chapter}
● _{Device Characteristics: Minimum value of tCH, tCL reduced to}
20 ns
● _{Typos and Clarifications}
● _{Added LM sensor devices}
● _{Changed VBAT external capacitor requirement to 1 µF}
● _{Typos and Clarifications}
● _{Glue Functions: Removed 2.5V voltage divider circuit for SM-}
Bus Voltage Translation system diagram
● _{Typos and Clarifications}
Revision 1.1
5
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