SM5010_06 Datasheet, PDF (3/25 Pages) Nippon Precision Circuits Inc – Crystal Oscillator Module ICs

PAD LAYOUT
(Unit: µm)
VDD
SM5010 series
PINOUT
(Top view)
Q (920,1180)
Y
HA5010
(0,0) _{INHN XT XTN VSS}
X
Chip size: 0.92 × 1.18mm
Chip thickness: 300 ± 30µm
Chip base: V_DD level
INHN 1
XT 2
XTN 3
VSS 4
8 VDD
7 NC
6 NC
5Q
PIN DESCRIPTION and PAD DIMENSIONS
Number Name
1
INHN
2
XT
3
XTN
4
VSS
5
Q
6
NC
7
NC
8
VDD
Pad dimensions [µm]
I/O
Description
X
Y
Output state control input. Standby mode when LOW, pull-up resistor built in. In
I
the case of the 5010CL×, the oscillator stops and Power-saving pull-up resistor is 195
built-in to reduce current consumption at standby mode.
174.4
I
Amplifier input.
O
Amplifier output.
Crystal oscillator connection pins.
Crystal oscillator connected between XT and XTN
385
174.4
575
174.4
–
Ground
765
174.4
O
Output. Output frequency (f_O, f_O/2, f_O/4, f_O/8, f_O/16) determined by internal
connection
757.6
1017.6
–
No connection
–
–
–
No connection
–
–
–
Supply voltage
165.4
1014.6
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