UPD784031 Datasheet, PDF (81/90 Pages) NEC – 16/8-BIT SINGLE-CHIP MICROCONTROLLER

µPD784031
Table 16-1. Soldering Conditions for Surface-Mount Devices (2/2)
(3) µPD784031GK-BE9: 80-pin plastic TQFP (fine pitch) (12 × 12 mm)
Soldering process
Infrared ray reflow
VPS
Partial heating method
Soldering conditions
Symbol
Peak package’s surface temperature: 235 °C
Reflow time: 30 seconds or less (210 °C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days^Note (10 hours of pre-baking is required at 125 °C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
IR35-107-2
Peak package’s surface temperature: 215 °C
Reflow time: 40 seconds or less (200 °C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days^Note (10 hours of pre-baking is required at 125 °C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
VP15-107-2
Terminal temperature: 300 °C or less
-
Heat time: 3 seconds or less (for one side of a device)
Note Maximum number of days during which the product can be stored at a temperature of 25 °C and a relative
humidity of 65 % or less after dry-pack package is opened.
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
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