UPD784031 Datasheet, PDF (80/90 Pages) NEC – 16/8-BIT SINGLE-CHIP MICROCONTROLLER

µPD784031
16. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the µPD784031.
For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting
Technology Manual (C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 16-1. Soldering Conditions for Surface-Mount Devices (1/2)
(1) µPD784031GC-3B9: 80-pin plastic QFP (14 × 14 × 2.7 mm)
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Symbol
Peak package's surface temperature: 235 °C
Reflow time: 30 seconds or less (210 °C or more)
Maximum allowable number of reflow processes: 3
IR35-00-3
Peak package's surface temperature: 215 °C
Reflow time: 40 seconds or less (200 °C or more)
Maximum allowable number of reflow processes: 3
VP15-00-3
Solder temperature: 260 °C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature : 120 °C max. (measured on the package surface)
WS60-00-1
Terminal temperature: 300 °C or less
-
Heat time: 3 seconds or less (for one side of a device)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
(2) µPD784031GC-8BT: 80-pin plastic QFP (14 × 14 × 1.4 mm)
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Symbol
Peak package's surface temperature: 235 °C
Reflow time: 30 seconds or less (210 °C or more)
Maximum allowable number of reflow processes: 2
IR35-00-2
Peak package's surface temperature: 215 °C
Reflow time: 40 seconds or less (200 °C or more)
Maximum allowable number of reflow processes: 2
VP15-00-2
Solder temperature: 260 °C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature : 120 °C max. (measured on the package surface)
WS60-00-1
Terminal temperature: 300 °C or less
-
Heat time: 3 seconds or less (for one side of a device)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
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