UPD78P324 Datasheet, PDF (72/80 Pages) NEC – 16-/8-Bit Single-Chip Microcomputers

µPD78P324, 78P324(A)
Figure A-2. Recommended Pattern for Conversion Socket (EV-9200G-74)
Substrate Installation (Reference)
G
J
K
C
B
A
ITEM
MILLIMETERS
EV-9200G-74-P0
INCHES
A
25.7
1.012
B
21.0
0.827
C
1.0±0.02 × 18=18.0±0.05
0.039 ^{+–00..000021}
×
0.709=0.709
+0.002
–0.003
D
1.0±0.02 × 18=18.0±0.05
0.039 ^{+–00..000021}
×
0.709=0.709
+0.002
–0.003
E
21.0
0.827
F
25.7
G
11.00±0.08
H
5.00±0.08
I
0.6±0.02
J
φ _2.36±0.03
K
φ _1.57±0.03
1.012
0.433^{+–00..000043}
0.197^{+–00..000034}
0.024^{+–00..000012}
φ _0.093^{+–00..000012}
φ _0.062^{+–00..000012}
Caution
Dimensions of mount pad for EV-9200 and that for target
device (QFP) may be different in some parts. For the
recommended mount pad dimensions for QFP, refer to
"SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL" (IEI-1207).
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