UPD78P324 Datasheet, PDF (70/80 Pages) NEC – 16-/8-Bit Single-Chip Microcomputers

µPD78P324, 78P324(A)
Table 9-2. Soldering Conditions for Surface-Mount Type (2)
µPD78P324GJ(A)-5BJ
µPD78P324GJ(A1)-5BJ
µPD78P324GJ(A2)-5BJ
: 74-pin plastic QFP (20 x 20 mm)
: 74-pin plastic QFP (20 x 20 mm)
: 74-pin plastic QFP (20 x 20 mm)
Soldering Method
Infrared reflow
VPS
Wave soldering
Pin part heating
Soldering Condition
Package peak temperature: 235 °C; time: within 30 secs (210 °C or more);
count: twice; day limit: 7 days^Note (hereafter, pre-baked for 36 hrs at 125 °C)
<Caution>
(1) The second reflow should be started after the temperature of the device
which would have been changed by the first reflow has returned to
normal.
(2) Please avoid flux water washing after the first reflow.
Package peak temperature: 215 °C; time: within 40 secs (200 °C or more);
count: within twice; day limit: 7 days^Note (hereafter, pre-baked for 36 hrs at
125 °C)
<Caution>
(1) The second reflow should be started after the temperature of the device
which would have been changed by the first reflow has returned to
normal.
(2) Please avoid flux water washing after the first reflow.
Solder bath temperature: no more than 260 °C; time: within 10 secs; count:
once; preheating temperature: up to 120 °C (package surface temperature);
day limit: 7 days^Note (hereafter, pre-baked for 36 hours at 125 °C)
Pin temperature: no more than 300 °C; time: within 3 secs (per device side)
Recommended
Condition Symbol
IR35-367-2
VP15-367-2
WS60-367-1
—
Note Refers to the number of days for storage after the dry pack is opened. The storage conditions are 25 °C
and no more than 65 %RH.
Caution Avoid using two or more soldering methods at the same time (except the pin part heating method).
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