UPD78P324 Datasheet, PDF (69/80 Pages) NEC – 16-/8-Bit Single-Chip Microcomputers

µPD78P324, 78P324(A)
9. RECOMMENDED SOLDERING CONDITIONS
Please solder the package of this product under the conditions recommended as follows.
For details of the recommended conditions for soldering, please refer to the information document
“Semiconductor Device Mounting Technology Manual” (IEI-1207).
For soldering methods and conditions other than those recommended below, please contact NEC sales
personnel.
Table 9-1. Soldering Conditions for Surface-Mount Type (1)
µPD78P324GJ-5BJ
µPD78P324LP
µPD78P324LP(A)
µPD78P324LP(A1)
µPD78P324LP(A2)
: 74-pin plastic QFP (20 x 20 mm)
: 68-pin plastic QFJ (s 950 mil)
: 68-pin plastic QFJ (s 950 mil)
: 68-pin plastic QFJ (s 950 mil)
: 68-pin plastic QFJ (s 950 mil)
Soldering Method
Infrared reflow
VPS
Wave soldering
Pin part heating
Soldering Condition
Package peak temperature : 230 °C; time : within 30 secs (210 °C or more);
count: once; day limit : 7 days^Note (hereafter, pre-baked for 36 hrs at 125 °C)
Package peak temperature : 215 °C; time : within 40 secs (200 °C or more);
count: once; day limit : 7 days^Note (hereafter, pre-baked for 36 hrs at 125 °C)
Solder bath temperature: no more than 260 °C; time : within 10 secs; count:
once; preheating temperature : 120 °C max. (package surface temperature);
day limit : 7 days^Note (hereafter, pre-baked for 36 hours at 125 °C)
Pin temperature : no more than 300 °C; time : within 3 secs (per device side)
Recommended
Condition Symbol
IR30-367-1
VP15-367-1
WS60-367-1
—
Note Refers to the number of days for storage after the dry pack is opened. The storage conditions are 25 °C
and no more than 65 %RH.
Caution Avoid using multiple soldering methods at the same time (except the pin part heating method).
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