UPD78F9177 Datasheet, PDF (47/56 Pages) NEC – 8-BIT SINGLE-CHIP MICROCONTROLLER

µPD78F9177, 78F9177Y
10. RECOMMENDED SOLDERING CONDITIONS
The µPD78F9177 and µPD789177Y should be soldered and mounted under the following recommended
conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 10-1. Surface Mounting Type Soldering Conditions (1/2)
µPD78F9177GB-8ES: 44-pin plastic LQFP (10 × 10)
µPD78F9177YGB-8ES: 44-pin plastic LQFP (10 × 10)
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Conditions
Package peak temperature: 235 °C, Time: 30 seconds max.
(at 210 °C or higher), Count: Twice or less
Package peak temperature: 215 °C, Time: 40 seconds max.
(at 200 °C or higher), Count: Twice or less
Solder bath temperature: 260 °C max., Time: 10 seconds max., Count:
Once, Preheating temperature: 120 °C max. (package surface
temperature)
Pin temperature: 300 °C max., Time: 3 seconds max. (per pin row)
Recommended Condition
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
−
Caution Do not use different soldering methods together (except for partial heating).
Table 10-1. Surface Mounting Type Soldering Conditions (2/2)
µPD78F9177YGA-9EU: 48-pin plastic TQFP (7 × 7)
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared reflow
Package peak temperature: 235 °C, Time: 30 seconds max.
(at 210 °C or higher), Count: Twice or less, Number of days:3^Note(After
that, prebaking sis necessary at 125 °C for 10 hours)
IR35-103-2
VPS
Package peak temperature: 215 °C, Time: 40 seconds max.
(at 200 °C or higher), Count: Twice or less, Number of days:3^Note(After
that, prebaking sis necessary at 125 °C for 10 hours)
VP15-103-2
Partial heating
Pin temperature: 300 °C max., Time: 3 seconds max. (per pin row)
−
Note The number of days for storage at 25°C, 65% RH MAX after the dry pack has been opened.
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet U14022EJ1V0DS00
47