MC9S12DJ64 Datasheet, PDF (91/126 Pages) Motorola, Inc – MC9S12DJ64 Device User Guide V01.17

MC9S12DJ64 Device User Guide — V01.17
Table A-5 Thermal Package Characteristics¹
Num C
Rating
Symbol Min
Typ
1 T _{Thermal Resistance LQFP112, single sided PCB}²
θ_JA
–
–
Thermal Resistance LQFP112, double sided PCB
2 T _{with 2 internal planes3}
θ_JA
–
–
3 T Junction to Board LQFP112
θ_JB
–
–
4 T Junction to Case LQFP112
θ_JC
–
–
5 T Junction to Package Top LQFP112
Ψ_JT
–
–
6 T Thermal Resistance QFP 80, single sided PCB
θ_JA
–
–
7
T
Thermal Resistance QFP 80, double sided PCB with
2 internal planes
θ_JA
–
–
8 T Junction to Board QFP80
θ_JB
–
–
9 T Junction to Case QFP80
θ_JC
–
–
10 T Junction to Package Top QFP80
Ψ_JT
–
–
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-3
3. PC Board according to EIA/JEDEC Standard 51-7
Max
54
41
31
11
2
51
41
27
14
3
Unit
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
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