MC68EC030 Datasheet, PDF (20/36 Pages) Motorola, Inc – Second-Generation 32-Bit Enhanced Embedded Controller

Freescale Semiconductor, Inc.
ELECTRICAL SPECIFICATIONS
MAXIMUM RATINGS
Rating
Supply Voltage
Input Voltage
Operating Temperature Range
Minimum Ambient Temperature
Maximum Ambient Temperature
Storage Temperature Range
Symbol
VCC
Vin
TA
TA
Tstg
Value
-0.3 to +7.0
-0.5 to +7.0
0
70
-55 to 150
Unit
V
V
°C
°C
THERMAL CHARACTERISTICS-- PGA PACKAGE
The device contains circuitry to
protect the inputs against damage
due to high static voltages or
electric fields; however, normal
precautions should be taken to
avoid application of voltages higher
than maximum-rated voltages to
these high-impedance circuits.
Tying unused inputs to the
appropriate logic voltage level (e.g.,
either GND or VCC) enhances
reliability of operation.
Characteristic
Thermal Resistance - Plastic
Junction to Ambient
Junction to case
Symbol Value Rating
o_C/W
θ_JA
32
TBD
θ_JC
POWER CONSIDERATIONS
The average chip-junction temperature, TJ, in ^oC can be obtained from:
TJ=TA+(PD • θ_JA)
(1)
where:
TA
θJA
PD
PINT
PI/O
= Ambient Temperature, ^oC
= Package Thermal Resistance, Junction-to-Ambient, ^oC/W
= PINT + PI/O
= ICC ^X VCC, Watts — Chip Internal Power
= Power Dissipation on Input and Output Pins — User Determined
For most applications, PI/O<PINT and can be neglected.
The following is an approximate relationship between PD and TJ (if PI/O is neglected):
PD=K ÷ (TJ+273^oC)
(2)
Solving Equations (1) and (2) for K gives:
K=PD • (TA + 273^oC) + θ_JA•PD²
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by
measuring PD (at thermal equilibrium) for a known TA. Using this value of K, the values of PD and TJ can
be obtained by solving equations (1) and (2) iteratively for any value of TA.
20
F^Mor^CM⁶⁸o^Ere^C0In³⁰for^Tm^Ea^Ct^Hio^Nn^ICO^An^LTh^Dis^ATP^Aroduct,
MOTOROLA
Go to: www.freescale.com