MT49H32M9 Datasheet, PDF (26/76 Pages) Micron Technology – 288Mb: x9, x18, x36 2.5V VEXT, 1.8V VDD, HSTL, CIO, RLDRAM II

288Mb: x9, x18, x36 2.5V VEXT, 1.8V VDD, HSTL, CIO, RLDRAM II
Electrical Specifications – AC and DC
Figure 10: Nominal ^tAS/^tCS/^tDS and ^tAH/^tCH/^tDH Slew Rate
VDDQ
VIH(AC) MIN
VIH(DC) MIN
VREF(DC)
VIL(DC) MAX
VIL(AC) MAX
VSSQ
Table 12: Capacitance
Notes 1–2 apply to entire table
Description
Address/control input capacitance
Input/output capacitance (DQ, DM, and QK/QK#)
Clock capacitance (CK/CK#, and DK/DK#)
JTAG pins
Symbol
CI
CO
CCK
CJTAG
Conditions
T_A = 25°C; f = 100 MHz
VDD = VDDQ = 1.8V
Notes: 1. Capacitance is not tested on ZQ pin.
2. JTAG pins are tested at 50 MHz.
Min
1.5
3.5
2.0
2.0
Max
2.5
5.0
3.0
5.0
Units
pF
pF
pF
pF
PDF: 09005aef80a41b46/Source: 09005aef809f284b
288Mb_RLDRAM_II_CIO_D2.fm - Rev M 9/07 EN
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