MT49H32M9 Datasheet, PDF (1/76 Pages) Micron Technology – 288Mb: x9, x18, x36 2.5V VEXT, 1.8V VDD, HSTL, CIO, RLDRAM II

288Mb: x9, x18, x36 2.5V VEXT, 1.8V VDD, HSTL, CIO, RLDRAM II
Features
CIO RLDRAM^® II
MT49H32M9 – 32 Meg x 9 x 8 Banks
MT49H16M18 – 16 Meg x 18 x 8 Banks
MT49H8M36 – 8 Meg x 36 x 8 Banks
Features
• 400 MHz DDR operation (800 Mb/s/pin data rate)
• 28.8 Gb/s peak bandwidth (x36 at 400 MHz
clock frequency)
• Organization
– 32 Meg x 9, 16 Meg x 18, and 8 Meg x 36
• 8 internal banks for concurrent operation and
maximum bandwidth
• Reduced cycle time (20ns at 400 MHz)
• Nonmultiplexed addresses (address multiplexing
option available)
• SRAM-type interface
• Programmable READ latency (RL), row cycle time,
and burst sequence length
• Balanced READ and WRITE latencies in order to
optimize data bus utilization
• Data mask for WRITE commands
• Differential input clocks (CK, CK#)
• Differential input data clocks (DKx, DKx#)
• On-die DLL generates CK edge-aligned data and
output data clock signals
• Data valid signal (QVLD)
• 32ms refresh (8K refresh for each bank; 64K refresh
command must be issued in total each 32ms)
• 144-ball µBGA package
• HSTL I/O (1.5V or 1.8V nominal)
• 25–60Ω matched impedance outputs
• 2.5V VEXT, 1.8V VDD, 1.5V or 1.8V VDDQ I/O
• On-die termination (ODT) RTT
Figure 1: 144-Ball µBGA
Options
Marking
• Clock cycle timing
– 2.5ns (400 MHz)
-25
– 3.3ns (300 MHz)
-33
– 5ns (200 MHz)
-5
• Configuration
– 32 Meg x 9
– 16 Meg x 18
– 8 Meg x 36
32M9
16M18
8M36
• Operating temperature
– Commercial (0° to +95°C)
– Industrial (T_C = –40°C to +95°C;
T_A = –40°C to +85°C)
• Package
– 144-ball µBGA
– 144-ball µBGA (Pb-free)
– 144-ball FBGA
– 144-ball FBGA (Pb-free)
None
IT¹
FM¹
BM²
HU³
HT^{2, 3}
Notes: 1. Contact Micron for availability of industrial
temperature products.
2. Contact Micron for availability of Pb-free
products.
3. The FBGA package is being phased out.
PDF: 09005aef80a41b46/Source: 09005aef809f284b
288Mb_RLDRAM_II_CIO_D1.fm - Rev M 9/07 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.