MT49H32M9 Datasheet, PDF (16/76 Pages) Micron Technology – 288Mb: x9, x18, x36 2.5V VEXT, 1.8V VDD, HSTL, CIO, RLDRAM II

288Mb: x9, x18, x36 2.5V VEXT, 1.8V VDD, HSTL, CIO, RLDRAM II
Package Dimensions
Package Dimensions
Figure 7: 144-Ball µBGA
SEATING PLANE
0.08 A ^A
10.70 CTR
10º TYP
2.41 CTR
0.08 MAX
144X Ø 0.45
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. THE
PRE-REFLOW BALL
DIAMETER IS 0.50 ON A
0.40 SMD BALL PAD.
8.80
BALL A12
MOLD
COMPOUND
0.80 TYP
BALL A1
BALL A1 ID
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2%Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SUBSTRATE MATERIAL:
PLASTIC LAMINATE
MOLD COMPOUND:
EPOXY NOVOLAC
BALL A1 ID
17.00 15.40
8.50
1.00 TYP
18.50 ±0.10
17.90 CTR
9.25 ±0.05
4.40
5.50 ±0.05
11.00 ±0.10
Notes: 1. All dimensions are in millimeters.
0.44 ±0.05
0.39 ±0.05
PDF: 09005aef80a41b46/Source: 09005aef809f284b
288Mb_RLDRAM_II_CIO_D2.fm - Rev M 9/07 EN
16
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©2003 Micron Technology, Inc. All rights reserved.