RFPIC12C509AG Datasheet, PDF (98/104 Pages) Microchip Technology – 18/20-Pin 8-Bit CMOS Microcontroller with UHF ASK/FSK Transmitter

rfPIC12C509AG/509AF
Package Type: 20-Lead SSOP
20-Lead Plastic Shrink Small Outline (SS) - 209 mil, 5.30 mm (SSOP)
E
E1
p
D
B
2
n
1
α
c
A
A2
φ
L
A1
β
Units
Number of Pins
Pitch
Dimension Limits
n
p
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
Lead Thickness
c
Foot Angle
φ
Lead Width
B
Mold Draft Angle Top
α
Mold Draft Angle Bottom
β
* Controlling Parameter
§ Significant Characteristic
MIN
.068
.064
.002
.299
.201
.278
.022
.004
0
.010
0
0
INCHES*
NOM
20
.026
.073
.068
.006
.309
.207
.284
.030
.007
4
.013
5
5
MAX
.078
.072
.010
.322
.212
.289
.037
.010
8
.015
10
10
MILLIMETERS
MIN
NOM
20
0.65
1.73
1.85
1.63
1.73
0.05
0.15
7.59
7.85
5.11
5.25
7.06
7.20
0.56
0.75
0.10
0.18
0.00
101.60
0.25
0.32
0
5
0
5
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
MAX
1.98
1.83
0.25
8.18
5.38
7.34
0.94
0.25
203.20
0.38
10
10
DS70031A-page 96
Preliminary
© 2001 Microchip Technology Inc.