PIC16F87_05 Datasheet, PDF (213/228 Pages) Microchip Technology – 18/20/28-Pin Enhanced Flash Microcontrollers with nanoWatt Technology

PIC16F87/88
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
E
EXPOSED
METAL
E1
PAD
n
CH X 45°
TOP VIEW
ı
α
A1
D1 D
2
1
A2
A
A3
D2
R
Q
p
B
E2
L
BOTTOM VIEW
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
Base Thickness
A3
Overall Width
E
Molded Package Width
E1
Exposed Pad Width
E2
Overall Length
D
Molded Package Length
D1
Exposed Pad Length
D2
Lead Width
B
Lead Length
L
Tie Bar Width
R
Tie Bar Length
Q
Chamfer
CH
Mold Draft Angle Top
ıα
MIN
.000
.140
.140
.009
. 020
. 005
.012
. 009
INCHES
NOM
28
.026 BSC
.033
.026
.0004
.008 REF
.236 BSC
.226 BSC
.146
.236 BSC
.226 BSC
.146
.011
. 024
. 007
.016
. 017
MAX
.039
.031
.002
.152
.152
.014
.030
.010
.026
.024
12°
MILLIMETERS*
MIN
NOM
28
0.65 BSC
0.85
0.65
0.00
0.01
0.20 REF
6.00 BSC
5.75 BSC
3.55
3.70
6.00 BSC
5.75 BSC
3.55
3.70
0.23
0.28
0.50
0.60
0.13
0.17
0.30
0.40
0.24
0.42
MAX
1.00
0.80
0.05
3.85
3.85
0.35
0.75
0.23
0.65
0.60
12°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: MO-220
Drawing No. C04-114
 2005 Microchip Technology Inc.
DS30487C-page 211