 English |
|
|
|
|
|
|
|
| PIC16F720_13 Datasheet, PDF (192/254 Pages) Microchip Technology – 20-Pin Flash Microcontrollers | |||
| |||
| ◁ |
PIC16(L)F720/721
23.5 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature-40°C ï£ TA ï£ +125°C
Param.
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
ï±JA Thermal Resistance Junction to
Ambient
62.2
ï°C/W 20-pin PDIP package
75.0
ï°C/W 20-pin SOIC package
89.3
ï°C/W 20-pin SSOP package
43.0
ï°C/W 20-pin QFN 4x4mm package
TH02
ï±JC Thermal Resistance Junction to
Case
27.5
ï°C/W 20-pin PDIP package
23.1
ï°C/W 20-pin SOIC package
31.1
ï°C/W 20-pin SSOP package
5.3
ï°C/W 20-pin QFN 4x4mm package
TH03
TJMAX Maximum Junction Temperature
150
ï°C
TH04
PD Power Dissipation
TH05 PINTERNAL Internal Power Dissipation
â
W PD = PINTERNAL + PI/O
â
W
PINTERNAL = IDD x VDD(1)
TH06
TH07
PI/O I/O Power Dissipation
PDER Derated Power
â
W PI/O = ï (IOL * VOL) + ï (IOH * (VDD -
VOH))
â
W
PDER = PDMAX (TJ - TA)/ï±JA(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature; TJ = Junction Temperature
DS41430D-page 192
ï£ 2010-2013 Microchip Technology Inc.
|
▷ |
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese