PIC16F630_06 Datasheet, PDF (118/130 Pages) Microchip Technology – 14-Pin, Flash-Based 8-Bit CMOS Microcontrollers

PIC16F630/676
14.2 Package Details
The following sections give the technical details of the
packages.
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
D
2
n
1
α
E
A
c
β
eB
A1
B1
B
A2
L
p
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
14
14
Pitch
p
.100
2.54
Top to Seating Plane
A
.140
.155
.170
3.56
3.94
4.32
Molded Package Thickness
A2
.115
.130
.145
2.92
3.30
3.68
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.300
.313
.325
7.62
7.94
8.26
Molded Package Width
E1
.240
.250
.260
6.10
6.35
6.60
Overall Length
D
.740
.750
.760
18.80
19.05
19.30
Tip to Seating Plane
L
.125
.130
.135
3.18
3.30
3.43
Lead Thickness
c
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.045
.058
.070
1.14
1.46
1.78
Lower Lead Width
B
.014
.018
.022
0.36
0.46
0.56
Overall Row Spacing
§ eB
.310
.370
.430
7.87
9.40
10.92
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
DS40039D-page 116
© 2006 Microchip Technology Inc.