PIC16F8X_13 Datasheet, PDF (113/128 Pages) Microchip Technology – 18-pin Flash/EEPROM 8-Bit Microcontrollers

PIC16F8X
Package Type: K04-051 18-Lead Plastic Small Outline (SO) – Wide, 300 mil
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
p
E
D
2
B
n
1
X
45 °
c
R1

L
R2
A

L1
A2

A1
Units
Dimension Limits
INCHES*
MIN
NOM
MAX
MILLIMETERS
MIN
NOM
MAX
Pitch
p
Number of Pins
n
Overall Pack. Height
A
0.093
0.050
18
0.099
0.104
2.36
1.27
18
2.50
2.64
Shoulder Height
A1
Standoff
A2
Molded Package Length D^‡
Molded Package Width
E^‡
0.048
0.004
0.450
0.292
0.058
0.008
0.456
0.296
0.068
0.011
0.462
0.299
1.22
0.10
11.43
7.42
1.47
0.19
11.58
7.51
1.73
0.28
11.73
7.59
Outside Dimension
E1
Chamfer Distance
X
Shoulder Radius
R1
0.394
0.010
0.005
0.407
0.020
0.005
0.419
0.029
0.010
10.01
0.25
0.13
10.33
0.50
0.13
10.64
0.74
0.25
Gull Wing Radius
R2
Foot Length
L
Foot Angle

0.005
0.011
0
0.005
0.016
4
0.010
0.021
8
0.13
0.28
0
0.13
0.41
4
0.25
0.53
8
Radius Centerline
L1
Lead Thickness
c
Lower Lead Width
B^†
Mold Draft Angle Top

Mold Draft Angle Bottom 
0.010
0.009
0.014
0
0
0.015
0.011
0.017
12
12
0.020
0.012
0.019
15
15
0.25
0.23
0.36
0
0
0.38
0.27
0.42
12
12
0.51
0.30
0.48
15
15
* _{Controlling Parameter.}
† _{Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”}
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ _{Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not}
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
 1996-2013 Microchip Technology Inc.
DS30430D-page 113