PIC16F8X_13 Datasheet, PDF (112/128 Pages) Microchip Technology – 18-pin Flash/EEPROM 8-Bit Microcontrollers

PIC16F8X
Package Type: K04-007 18-Lead Plastic Dual In-line (P) – 300 mil
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
D
2
n
1

E1
A1
A
R
c

eB
A2
B1
B
L
p
Units
Dimension Limits
PCB Row Spacing
Number of Pins
n
Pitch
p
Lower Lead Width
B
Upper Lead Width
B1^†
Shoulder Radius
R
Lead Thickness
c
Top to Seating Plane
A
Top of Lead to Seating Plane A1
Base to Seating Plane
A2
Tip to Seating Plane
L
Package Length
D^‡
Molded Package Width
E^‡
Radius to Radius Width
E1
Overall Row Spacing
eB
Mold Draft Angle Top

Mold Draft Angle Bottom

MIN
0.013
0.055
0.000
0.005
0.110
0.075
0.000
0.125
0.890
0.245
0.230
0.310
5
5
INCHES*
NOM
0.300
18
0.100
0.018
0.060
0.005
0.010
0.155
0.095
0.020
0.130
0.895
0.255
0.250
0.349
10
10
MAX
0.023
0.065
0.010
0.015
0.155
0.115
0.020
0.135
0.900
0.265
0.270
0.387
15
15
MILLIMETERS
MIN
NOM
7.62
18
2.54
0.33
0.46
1.40
1.52
0.00
0.13
0.13
0.25
2.79
3.94
1.91
2.41
0.00
0.51
3.18
3.30
22.61
22.73
6.22
6.48
5.84
6.35
7.87
8.85
5
10
5
10
MAX
0.58
1.65
0.25
0.38
3.94
2.92
0.51
3.43
22.86
6.73
6.86
9.83
15
15
* Controlling Parameter.
† _{Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”}
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡ _{Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not}
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
DS30430D-page 112
 1996-2013 Microchip Technology Inc.