MLX80004 Datasheet, PDF (6/38 Pages) Melexis Microelectronic Systems – Enhanced Universal Dual/Quad LIN Transceiver

MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
6. Pin Description
Figure 2: Pinout MLX80004 QFN24 package
Figure 3: Pinout MLX80002 QFN24 package
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
EPad
MLX80004 MLX80002
RxD1
TxD1
MODE0
MODE1
TxD4
N.C.
RxD4
N.C.
DIS_MAS
N.C.
LIN4
N.C.
GNDL
LIN3
N.C.
WAKE
RxD3
N.C.
TxD3
N.C.
GND
TxD2
RxD2
N.C.
INH
VS
LIN2
GNDL
LIN1
N.C.
GND / GNDL
Table 1: Pin List
I/O-Type
O
I
I
I
I
O
I
Description
Receive Data LIN Ch1, open drain
Transmit Data LIN Ch1 (+ local WU-Flag)
Operating Mode Selection Input 1
Operating Mode Selection Input 2
Transmit Data LIN Ch4
Receive Data LIN Ch4, open drain
disable integrated master resistor
I/O
LIN Bus Ch4
G
Ground LIN
I/O
LIN Bus Ch3
I
local wake up input, low active
O
Receive Data LIN Ch3, open drain
I
Transmit Data LIN Ch3
G
Ground
I
Transmit Data LIN Ch2
O
Receive Data LIN Ch2, open drain
O
HV High Side Control Pin
P
Battery Voltage
I/O
LIN Bus Ch2
G
Ground LIN
I/O
LIN Bus Ch1
G
Exposed Pad of Package (grounded heatsink)¹
1 _{For enhanced thermal and electrical performance, the exposed pad of the QFN package should be soldered}
to the board ground plane (and not to any other voltage level).
Revision 021 – Sept 2016
Page 6 of 38