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| MAX11634 Datasheet, PDF (2/24 Pages) Maxim Integrated Products – 12-Bit, 300ksps ADCs with Differential | |||
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12-Bit, 300ksps ADCs with Differential
Track/Hold, and Internal Reference
ABSOLUTE MAXIMUM RATINGS
VDD to GND ..............................................................-0.3V to +6V
CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (VDD + 0.3V)
AIN0âAIN5, REF-/AIN6, CNVST/AIN7,
REF+ to GND.........................................-0.3V to (VDD + 0.3V)
Maximum Current into any Pin ............................................50mA
Continuous Power Dissipation (TA = +70°C)
QSOP (single-layer board)
(derate 8.3mW/°C above +70°C) .................................667mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
QSOP
Junction-to-Ambient Thermal Resistance (θJA)...............105°C/W
Junction-to-Case Thermal Resistance (θJC)......................37°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 3.6V (MAX11635/MAX11637), VDD = 4.75V to 5.25V (MAX11634/MAX11636), fSAMPLE = 300kHz, fSCLK = 4.8MHz
(external clock, 50% duty cycle), VREF = 2.5V (MAX11635/MAX11637), VREF = 4.096V (MAX11634/MAX11636) TA = TMIN to TMAX,
unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER
DC ACCURACY (Note 3)
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
SYMBOL
CONDITIONS
RES
INL
DNL
No missing codes over temperature
(Note 4)
MIN TYP MAX UNITS
12
Bits
±1.0 LSB
±1.0 LSB
±0.5 ±4.0 LSB
±0.5 ±4.0 LSB
Offset Error Temperature
Coefficient
±2
ppm/°C
FSR
Gain Temperature Coefficient
±0.8
ppm/°C
Channel-to-Channel Offset
Matching
±0.1
LSB
DYNAMIC SPECIFICATIONS (30kHz sine-wave input, 300ksps, fSCLK = 4.8MHz)
Signal-to-Noise Plus Distortion
SINAD
MAX11635/MAX11637
MAX11634/MAX11636
Total Harmonic Distortion
THD
Up to the 5th MAX11635/MAX11637
harmonic
MAX11634/MAX11636
Spurious-Free Dynamic Range
SFDR
MAX11635/MAX11637
MAX11634/MAX11636
Intermodulation Distortion
IMD
fIN1 = 29.9kHz, fIN2 = 30.2kHz
Full-Power Bandwidth
-3dB point
Full-Linear Bandwidth
S/(N + D) > 68dB
71
dB
73
-80
dBc
-88
81
dBc
89
76
dBc
1
MHz
100
kHz
2 _______________________________________________________________________________________
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