LTC3815_15 Datasheet, PDF (41/42 Pages) Linear Technology – 6A Monolithic Synchronous DC/DC Step-Down Converter with Digital Power System Management

Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
38₍-_R³L_e⁸e_f^-_ea^L_rd_e^e_n^aP_c^d_ela^PU_Ls_T^lFat_C^UiE^sc^F_D^tPEi_WQ^caPF_G^QcaNk^F_#^caN(^k₀^g4a₅^(emg_-⁴₀^emm_8-^m₁×₇^×₅6₀⁶m_R^mm_e^m_v)_B⁾ ₎
(Reference LTC DWG # 05-08-1750 Rev B)
0.70 ±0.05
LTC3815
4.50 ±0.05
3.10 ±0.05
2.40 REF
2.65 ±0.05
4.65 ±0.05
PACKAGE OUTLINE
0.20 ±0.05
0.40 BSC
4.40 REF
5.10 ±0.05
6.50 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ±0.10
0.75 ±0.05
R = 0.10
TYP
PIN 1
TOP MARK
(NOTE 6)
2.40 REF
PIN 1 NOTCH
R = 0.30 OR
0.35 × 45°
CHAMFER
37 38
0.40 ±0.10
1
2
4.65 ±0.10
6.00 ±0.10
4.40 REF
2.65 ±0.10
0.200 REF R = 0.115
0.00 – 0.05
TYP
(UFE38) QFN 0708 REV B
0.20 ±0.05
0.40 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconneFcotiornmoof irtseciinrcfouirtms aastdioenscwribwedwh.leinreeinarw.cilol nmot/LinTfCrin3g8e1o5n existing patent rights.
3815p
41