LTC3899_15 Datasheet, PDF (37/38 Pages) Linear Technology – 60V Low IQ, Triple Output, Buck/Buck/Boost Synchronous Controller

Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701 Rev C)
0.70 ±0.05
5.50 ±0.05
4.10 ±0.05
3.00 REF
5.15 ±0.05
3.15 ±0.05
LTC3899
0.25 ±0.05
0.50 BSC
5.5 REF
6.10 ±0.05
7.50 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 ±0.10
PIN 1
TOP MARK
(SEE NOTE 6)
0.75 ±0.05
0.00 – 0.05
PACKAGE
OUTLINE
3.00 REF
37 38
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45° CHAMFER
0.40 ±0.10
1
2
7.00 ±0.10
5.50 REF
5.15 ±0.10
3.15 ±0.10
0.200 REF 0.25 ±0.05
0.50 BSC
R = 0.125
TYP
BOTTOM VIEW—EXPOSED PAD
(UH) QFN REF C 1107
R = 0.10
TYP
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconneFcotiornmoof irtseciinrcfouirtms aastdioenscwribwedwh.leinreeinarw.cilol nmot/LinTfCrin3g8e9o9n existing patent rights.
3899f
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