LTC3709_15 Datasheet, PDF (23/24 Pages) Linear Technology – Fast 2-Phase, No RSENSE Synchronous DC/DC Controller with Tracking/Sequencing

PACKAGE DESCRIPTIO
UH Package
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693)
LTC3709
0.70 ±0.05
5.50 ±0.05
4.10 ±0.05
3.50 REF
(4 SIDES)
3.45 ± 0.05
3.45 ± 0.05
PACKAGE OUTLINE
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
PIN 1
TOP MARK
(NOTE 6)
R = 0.05
TYP
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
31 32
3.50 REF
(4-SIDES)
3.45 ± 0.10
3.45 ± 0.10
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 × 45° CHAMFER
0.40 ± 0.10
1
2
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.25 ± 0.05
0.50 BSC
(UH32) QFN 0406 REV D
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3709fb
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