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LTC3890-3 Datasheet, PDF (19/40 Pages) Linear Technology – 60V Low IQ, Dual, 2-Phase Synchronous Step-Down DC/DC Controller
LTC3890-3
Applications Information
The optional Schottky diodes D3 and D4 shown in
Figure 11 conduct during the dead-time between the
conduction of the two power MOSFETs. This prevents
the body diode of the bottom MOSFET from turning on,
storing charge during the dead-time and requiring a
reverse recovery period that could cost as much as 3%
in efficiency at high VIN. A 1A to 3A Schottky is generally
a good compromise for both regions of operation due
to the relatively small average current. Larger diodes
result in additional transition losses due to their larger
junction capacitance.
CIN and COUT Selection
The selection of CIN is simplified by the 2-phase architec-
ture and its impact on the worst-case RMS current drawn
through the input network (battery/fuse/capacitor). It can be
shown that the worst-case capacitor RMS current occurs
when only one controller is operating. The controller with
the highest (VOUT)(IOUT) product needs to be used in the
formula shown in Equation 1 to determine the maximum
RMS capacitor current requirement. Increasing the out-
put current drawn from the other controller will actually
decrease the input RMS ripple current from its maximum
value. The out-of-phase technique typically reduces the
input capacitor’s RMS ripple current by a factor of 30%
to 70% when compared to a single phase power supply
solution.
In continuous mode, the source current of the top MOSFET
is a square wave of duty cycle (VOUT)/(VIN). To prevent
large voltage transients, a low ESR capacitor sized for the
maximum RMS current of one channel must be used. The
maximum RMS capacitor current is given by:
( ) CIN
Required IRMS
≈
IMAX
VIN
(VOUT
)
VIN – VOUT
1/2 (1)
This formula has a maximum at VIN = 2VOUT , where IRMS
= IOUT/2. This simple worst-case condition is commonly
used for design because even significant deviations do not
offer much relief. Note that capacitor manufacturers’ ripple
current ratings are often based on only 2000 hours of life.
This makes it advisable to further derate the capacitor, or
to choose a capacitor rated at a higher temperature than
required. Several capacitors may be paralleled to meet
size or height requirements in the design. Due to the high
operating frequency of the LTC3890-3, ceramic capacitors
can also be used for CIN. Always consult the manufacturer
if there is any question.
The benefit of the LTC3890-3 2-phase operation can be
calculated by using Equation 1 for the higher power control-
ler and then calculating the loss that would have resulted
if both controller channels switched on at the same time.
The total RMS power lost is lower when both controllers
are operating due to the reduced overlap of current pulses
required through the input capacitor’s ESR. This is why
the input capacitor’s requirement calculated above for the
worst-case controller is adequate for the dual controller
design. Also, the input protection fuse resistance, battery
resistance, and PC board trace resistance losses are also
reduced due to the reduced peak currents in a 2-phase
system. The overall benefit of a multiphase design will
only be fully realized when the source impedance of the
power supply/battery is included in the efficiency testing.
The drains of the top MOSFETs should be placed within
1cm of each other and share a common CIN(s). Separating
the drains and CIN may produce undesirable voltage and
current resonances at VIN.
A small (0.1µF to 1µF) bypass capacitor between the chip
VIN pin and ground, placed close to the LTC3890-3, is
also suggested. A 10Ω resistor placed between CIN (C1)
and the VIN pin provides further isolation between the
two channels.
For more information www.linear.com/3890-3
38903f
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