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LTC3717 Datasheet, PDF (15/20 Pages) Linear Technology – Wide Operating Range, No RSENSE Step-Down Controller for DDR/QDR Memory Termination
LTC3717
APPLICATIO S I FOR ATIO
(This is typically the case, since VIN is derived from
another DC/DC converter.) The ripple voltage will be only:
∆VOUT(RIPPLE) = ∆IL(MAX) (ESR)
= (4A) (0.013Ω) = 52mV
However, a 0A to 10A load step will cause an output
change of up to:
∆VOUT(STEP) = ∆ILOAD (ESR) = (10A) (0.013Ω) = 130mV
An optional 22µF ceramic output capacitor is included to
minimize the effect of ESL in the output ripple. The
complete circuit is shown in Figure 6.
PC Board Layout Checklist
When laying out a PC board follow one of the two sug-
gested approaches. The simple PC board layout requires
a dedicated ground plane layer. Also, for higher currents,
it is recommended to use a multilayer board to help with
heat sinking power components.
• The ground plane layer should not have any traces and
it should be as close as possible to the layer with power
MOSFETs.
• Place CIN, COUT, MOSFETs, D1 and inductor all in one
compact area. It may help to have some components on
the bottom side of the board.
• Place LTC3717 chip with pins 9 to 16 facing the power
components. Keep the components connected to pins
1 to 8 close to LTC3717 (noise sensitive components).
• Use an immediate via to connect the components to
ground plane including SGND and PGND of LTC3717.
Use several bigger vias for power components.
• Use compact plane for switch node (SW) to improve
cooling of the MOSFETs and to keep EMI down.
• Use planes for VIN and VOUT to maintain good voltage
filtering and to keep power losses low.
CSS
0.1µF
R3 R4
11k 39k
CC1
470pF
RC
20k
CC2
100pF
CON 0.01µF
RON
511k
LTC3717
1 RUN/SS
16
BOOST
RPG
100k 2 PGOOD
15
TG
3 VRNG
4 ITH
5 SGND
14
SW
13
PGND
12
BG
6 ION
11
INTVCC
7 VFB
10
VCC
8 VREF
9
EXTVCC
(OPT)
0.1µF
10Ω
DB
CMDSH-3
CB
0.22µF
CVCC
4.7µF
RF
1Ω
CF
0.1µF
M1
Si4874
M2
Si4874
D2
B320A
L1
0.68µH
D1
B320A
VEXT 5V
CIN, COUT1-2: CORNELL DUBILIER ESRE181E04B
L1: SUMIDA CEP125-0R68MC-H
Figure 6. Design Example: 1.25V/±10A at 250kHz
CIN +
22µF
CIN VIN = 2.5V
180µF
6.3V
4V
X7R
×2 VOUT
1.25V
+ COUT1-2
270µF
±10A
COUT3
22µF
2V
6.3V
×2
X7R
3717 F06a
sn3717 3717fs
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