1032EA Datasheet, PDF (6/16 Pages) Lattice Semiconductor – In-System Programmable High Density PLD

Specifications ispLSI 1032EA
External Timing Parameters
Over Recommended Operating Conditions
PARAMETER ^{TEST 4} #²
COND.
DESCRIPTION¹
tpd1
A
tpd2
A
fmax (Int.) A
fmax (Ext.) —
fmax (Tog.) —
tsu1
—
1 Data Propagation Delay, 4PT Bypass, ORP Bypass
2 Data Propagation Delay, Worst Case Path
3 Clock Frequency with Internal Feedback ³
4
Clock
Frequency
with
External
Feedback
(1
tsu2 +
) _tco1
5
Clock
Frequency,
Max.
Toggle
(
1
twh +
twl
)
6 GLB Reg. Setup Time before Clock,4 PT Bypass
-200
-170
UNITS
MIN. MAX. MIN. MAX.
— 4.5 — 5.0 ns
— 6.0 — 7.0 ns
200 — 170 — MHz
143 — 125 — MHz
250 — 222 — MHz
3.0 — 3.5 — ns
tco1
A 7 GLB Reg. Clock to Output Delay, ORP Bypass
— 3.5 — 3.5 ns
th1
— 8 GLB Reg. Hold Time after Clock, 4 PT Bypass
0.0 — 0.0 — ns
tsu2
tco2
th2
tr1
trw1
tptoeen
tptoedis
tgoeen
tgoedis
twh
twl
— 9 GLB Reg. Setup Time before Clock
— 10 GLB Reg. Clock to Output Delay
— 11 GLB Reg. Hold Time after Clock
A 12 Ext. Reset Pin to Output Delay
— 13 Ext. Reset Pulse Duration
B 14 Input to Output Enable
C 15 Input to Output Disable
B 16 Global OE Output Enable
C 17 Global OE Output Disable
— 18 External Synchronous Clock Pulse Duration, High
— 19 External Synchronous Clock Pulse Duration, Low
3.5 — 4.5 — ns
— 4.0 — 4.5 ns
0.0 — 0.0 — ns
— 5.5 — 7.0 ns
3.5 — 4.0 — ns
— 7.0 — 9.0 ns
— 7.0 — 9.0 ns
— 4.5 — 6.5 ns
— 4.5 — 6.5 ns
2.0 — 2.25 — ns
2.0 — 2.25 — ns
tsu3
— 20 I/O Reg. Setup Time before Ext. Sync Clock (Y2, Y3)
3.0 — 3.0 — ns
th3
— 21 I/O Reg. Hold Time after Ext. Sync. Clock (Y2, Y3)
0.0 — 0.0 — ns
1.
Unless noted otherwise, all parameters use a GRP load of four GLBs, 20 PTXOR path, ORP and Y0 clock.
Table 2-0030A/1032EA
v.2.4
2. Refer to Timing Model in this data sheet for further details.
3. Standard 16-bit counter using GRP feedback.
4. Reference Switching Test Conditions section.
6