ISL6540_06 Datasheet, PDF (6/20 Pages) Intersil Corporation – Single-Phase Buck PWM Controller with Integrated High Speed MOSFET Driver and Pre-Biased Load Capability

ISL6540
Absolute Maximum Ratings
Input Voltage, VIN, VFF . . . . . . . . . . . . . . . . . . . . . . -0.3V to +22.0V
Driver Bias Voltage, PVCC . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V
Signal Bias Voltage, VCC . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V
Boot Voltage, V_BOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +36V
Phase Voltage, V_PHASE . . . . . . . . . . V_BOOT - 6V to V_BOOT + 0.3V
Boot to Phase Voltage, V_BOOT - V_PHASE . . . . . . . . . . . . . . . . . . .6V
Other Input or Output Voltages . . . . . . . . . . . . . -0.3V to VCC +0.3V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2
Thermal Information
Thermal Resistance (Note 1, 2)
θ_JA (°C/W) θ_JC (°C/W)
QFN Package (Note 1, 2) . . . . . . . . . 32
5
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
Recommended Operating Conditions
Input Voltage, VIN, VFF . . . . . . . . . . . . . . . . . . . . 3.3V to 20V ±10%
Driver Bias Voltage, PVCC . . . . . . . . . . . . . . . . . . . . . . 2.9V to 5.6V
Signal Bias Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . 2.9V to 5.6V
Boot to Phase Voltage (Overcharged), V_BOOT - V_PHASE . . . . . .<6V
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Junction Temperature Range. . . . . . . . . . . . . . . . . . .-40°C to 125°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
2. θ_JC, "case temperature" location is at the center of the package underside exposed pad. See Tech Brief TB379 for details.
3. Test conditions identified as “GBD” are guaranteed by design simulation.
Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted
SYMBOL
PARAMETER
TEST CONDITIONS
INPUT SUPPLY CURRENTS
I_VCC
Nominal VCC Supply Current
VIN = VCC = PVCC = 5V, Fs = 600kHz,
UGATE and LGATE Open
I_PVCC
Nominal PVCC Supply Current
VIN = VCC = PVCC = 5V; Fs = 600kHz,
UGATE and LGATE Open
I_VIN
Nominal Vin Supply Current
VIN = VCC = PVCC = 5V; Fs = 600kHz,
UGATE and LGATE Open
I_{PVCC_S}
Shutdown VCC Supply Current
I_{VCC_S}
Shutdown PVCC Supply Current
I_{VIN_S}
Shutdown VIN Supply Current
POWER-ON RESET
EN = 0V, VCC = PVCC = VIN = 5V
EN = 0V, VCC = PVCC = VIN = 5V
EN = 0V, VCC = PVCC = VIN = 5V
POR_{VCC_R}
POR_{VCC_F}
POR_{VCC_H}
POR_{PVCC_R}
POR_{PVCC_F}
POR_{PVCC_H}
POR_{VFF_R}
POR_{VFF_F}
POR_{VFF_H}
ENABLE
Rising VCC Threshold
Falling VCC Threshold
VCC Hysterisis
Rising PVCC Threshold
Falling PVCC Threshold
PVCC Hysterisis
Rising VFF Threshold
Falling VFF Threshold
VFF Hysterisis
V_{EN_REF}
I_{EN_HYS}
V_EN
Input Reference Voltage
Hysteresis Source Current
Maximum Input Voltage
MIN
TYP
MAX UNITS
-
8
-
5
-
1
-
7
-
1
-
1
-
mA
-
mA
-
mA
-
mA
-
mA
-
mA
-
-
2.90
V
2.58
-
-
V
184
202
217
mV
-
-
2.90
V
2.58
-
-
V
187
204
223
mV
-
-
1.54
V
1.35
-
-
V
124
135
146
mV
0.480
0.496
0.512
V
7
10
15
µA
-
VCC+0.3
-
V
6
FN9214.0
March 9, 2006