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X96010 Datasheet, PDF (3/26 Pages) Intersil Corporation – Sensor Conditioner with Dual Look Up Table Memory and DACs
X96010
ABSOLUTE MAXIMUM RATINGS
All voltages are referred to Vss.
Temperature under bias ................... -65°C to +100°C
Storage temperature ........................ -65°C to +150°C
Voltage on every pin except Vcc ................ -1.0V to +7V
Voltage on Vcc Pin .............................................0 to 5.5V
D.C. Output Current at pin SDA ...................... 0 to 5 mA
D.C. Output Current at pins R1, R2, and
VRef ........................................................ -0.50 to 1 mA
D.C. Output Current at pins I1 and I2 ....... -3.5 to +3.5mA
Lead temperature (soldering, 10s) .................... 300°C
RECOMMENDED OPERATING CONDITIONS
Parameter
Temperature
Temperature while writing to memory
Voltage on Vcc Pin
Voltage on any other Pin
COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device (at these or any other conditions above those
listed in the operational sections of this specification) is
not implied. Exposure to absolute maximum rating con-
ditions for extended periods may affect device reliability.
Min.
-40
0
3
-0.3
Max.
+100
+70
5.5
Vcc + 0.3
Units
°C
°C
V
V
ELECTRICAL CHARACTERISTICS (Conditions are as follows, unless otherwise specified)
All typical values are for 25°C ambient temperature and 5V at pin Vcc. Maximum and minimum specifications are over
the recommended operating conditions. All voltages are referred to the voltage at pin Vss. Bit 3 in Control register 0 is
“1”, while all other bits in control registers are “0”. 255Ω, 0.1%, resistor connected between R1 and Vss, and another
between R2 and Vss. 400kHz TTL input at SCL. SDA pulled to Vcc through an external 2kΩ resistor. 2-wire interface
in “standby” (see notes 1 and 2 on page 5). WP, A0, A1, and A2 floating. VRef pin unloaded.
Symbol
Parameter
Min Typ Max Unit
Test Conditions / Notes
Iccstby
Standby current into Vcc
pin
2
mA R1 and R2 floating, VRef unloaded.
Iccfull
Full operation current into
Vcc pin
15 mA 2-wire interface reading from
memory, I1 and I2 both connected to
Vss, DAC input bytes: FFh, VRef
unloaded.
Iccwrite
Nonvolatile Write current
into Vcc pin
4
mA Average from START condition until
tWP after the STOP condition
WP: Vcc, R1 and R2 floating,
VRef unloaded.
IPLDN
On-chip pull down current
0
at WP, A0, A1, and A2
1
20
µA V(WP), V(A0), V(A1), and V(A2) from
0V to Vcc
VILTTL
SCL and SDA, input Low
voltage
0.8
V
VIHTTL
SCL and SDA, input High 2.0
V
voltage
IINTTL
SCL and SDA input
-1
current
10
µA Pin voltage between 0 and Vcc, and
SDA as an input.
VOLSDA
IOHSDA
VILCMOS
SDA output Low voltage
0
SDA output High current
0
WP, A0, A1, and A2 input
0
Low voltage
0.4
100
0.2 x
Vcc
V I(SDA) = 2 mA
µA V(SDA) = Vcc
V
3
FN8214.1
October 25, 2005