80C88 Datasheet, PDF (27/32 Pages) Intersil Corporation – CMOS 8/16-Bit Microprocessor

Die Characteristics
DIE DIMENSIONS:
249.2 x 290.9 x 19 ±1mils
METALLIZATION:
Type: Silicon - Aluminum
Thickness: 11kÅ ±2kÅ
Metallization Mask Layout
A11 A12
80C88
GLASSIVATION:
Type: SiO₂
Thickness: 8kÅ ±1kÅ
WORST CASE CURRENT DENSITY:
1.5 x 10⁵ A/cm²
A13 A14
80C88
GND
V_CC
A15 A16/S3 A17/S4 A18/S5
A10
A9
A8
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
NMI INTR CLK
A19/S6
SSO
MN/MX
RD
HOLD
HLDA
WR
IO/M
DT/R
GND
RESET READY TEST INTA ALE DEN
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