ISL33001 Datasheet, PDF (2/19 Pages) Intersil Corporation – I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability

ISL33001, ISL33002, ISL33003
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
ISL33001IRTZ
3001
-40 to +85
8 Ld TDFN (0.65mm Pitch)
L8.3x3A
ISL33001IRT2Z
01R2
-40 to +85
8 Ld TDFN (0.5mm Pitch)
L8.3x3H
ISL33001IBZ
33001 IBZ
-40 to +85
8 Ld SOIC
M8.15
ISL33001IUZ
33001
-40 to +85
8 Ld MSOP
M8.118
ISL33002IRTZ
3002
-40 to +85
8 Ld TDFN (0.65mm Pitch)
L8.3x3A
ISL33002IRT2Z
02R2
-40 to +85
8 Ld TDFN (0.5mm Pitch)
L8.3x3H
ISL33002IUZ
33002
-40 to +85
8 Ld MSOP
M8.118
ISL33003IRTZ
3003
-40 to +85
8 Ld TDFN (0.65mm Pitch)
L8.3x3A
ISL33003IRT2Z
03R2
-40 to +85
8 Ld TDFN (0.5mm Pitch)
L8.3x3H
ISL33003IUZ
33003
-40 to +85
8 Ld MSOP
M8.118
ISL33001MSOPEVAL1Z ISL33001 Evaluation Board
ISL33002MSOPEVAL1Z ISL33002 Evaluation Board
ISL33003MSOPEVAL1Z ISL33003 Evaluation Board
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL33001, ISL33002, ISL33003. For more
information on MSL please see techbrief TB363.
Pin Configurations
ISL33001
(8 LD TDFN)
TOP VIEW
ISL33001
(8 LD SOIC, MSOP)
TOP VIEW
EN 1
SCL_OUT 2
SCL_IN 3
GND 4
PAD
8 VCC1
7 SDA_OUT
6 _{SDA_IN}
5 READY
EN 1
SCL_OUT 2
SCL_IN 3
GND 4
8 ^VCC1
7 SDA_OUT
6 SDA_IN
5 _READY
2
FN7560.2
September 30, 2010