80C286883 Datasheet, PDF (13/13 Pages) Intersil Corporation – High Performance Microprocessor with Memory Management and Protection

Die Characteristics
DIE DIMENSIONS:
286 x 283 x 19 ±1mils
METALLIZATION:
Type: Si-Al
Thickness: 8kÅ
Metallization Mask Layout
80C286/883
GLASSIVATION:
Type: Nitrox
Thickness: 10kÅ
WORST CASE CURRENT DENSITY: 2 X 10⁵A/cm²
LEAD TEMPERATURE: (10s Soldering): ≤ 300^oC
80C286/883
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Spec Number
140