82563EB Datasheet, PDF (45/52 Pages) Intel Corporation – Intel® 82563EB/82564EB Gigabit Ethernet Controllers

82563EB/82564EB Gigabit Platform LAN Connect Networking Silicon
5.2
Thermal Specifications
The 82563EB/82564EB device is specified for operation when the ambient temperature (T_A) is
within the range of 0^° C to 60^° C.
The maximum junction temperature is 120° C. The maximum ambient temperature with airflow
and/or a heatsink can be calculated using the thermal coefficient data below and the power
specification (see section 4.7)
T_C (case temperature) is calculated using the equation:
T_C = T_A + P (θ_JA - θ_JC)
T_J (junction temperature) is calculated using the equation:
T_J = T_A + P θ_JA
P (power consumption) is calculated by using the typical I_CC, as indicated in Table 38, and nominal
V_CC. The preliminary thermal resistances are shown in Table 38.
Table 38. Thermal Characteristics
Value @ Given Airflow (m/s)
Symbol
θJ_A
θJ_C
Parameter
0
Thermal Resistance, Junction to Ambient 26.1
Thermal Resistance, Junction to Case
12.7
1
22.9
-
2
21.7
-
3
Units
21.1 °C/watt
-
°C/watt
39