TLE4966V-1K_15 Datasheet, PDF (5/24 Pages) Infineon Technologies AG – In Plane Sensing with Vertical Dual Hall Effect Latch for Automotive Applications

TLE4966V-1K
List of Figures
List of Figures
Figure 1-1
Figure 1-2
Figure 2-1
Figure 2-2
Figure 2-3
Figure 2-4
Figure 2-5
Figure 2-6
Figure 2-7
Figure 3-1
Figure 4-1
Figure 4-2
Figure 4-3
Figure 5-1
Figure 5-2
Figure 5-3
Figure 5-4
Figure 5-5
Figure 5-6
Image of TLE4966V in the PG-TSOP6-6-5 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Target Application (top and side view): Sensing Direction parallel to target wheel . . . . . . . . . . . . . 7
Target Application: Side view and top view for In-Plane Sensing. . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Magnetic field signal with the corresponding speed & direction output including the definition of the
direction signal 9
PG-TSOP6-6-5 Pin Configuration and sensitive area (d = 1.25mm) (see table 2-2) . . . . . . . . . . . 10
Functional Block Diagram of the TLE4966V-1K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Start-up behavior of the at different magnetic start conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Basic Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Enhanced Application Circuit for very high ESD robustness on system level . . . . . . . . . . . . . . . . 13
EMC test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Timing Diagram TLE4966V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
TLE4966V - Output Voltage Signal over applied magnetic Field . . . . . . . . . . . . . . . . . . . . . . . . . . 19
TLE4966V - Definition of the direction signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Image of TLE4966V in the PG-TSOP6-6-5 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
PG-TSOP6-6-5 Package Outline (All dimensions in mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
PG-TSOP6-6-5 Packing (All dimensions in mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Footprint of PG-TSOP-6-6-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Distance between chip and package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Marking of TLE4966V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Data Sheet
5
Revision 1.0, 2014-05-13