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HYB18T256324F-16 Datasheet, PDF (43/80 Pages) Infineon Technologies AG – 256-Mbit GDDR3 DRAM [600MHz]
HYB18T256324F–[16/20/22]
256-Mbit DDR SGRAM
Functional Description
3.7.6
Write followed by DTERDIS

#, +
#,+
#O M 
72



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$% 3
$% 3

$% 3

$% 3

$% 3

$% 3

$% 3

$% 3
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7,  
72
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72
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Figure 26 Write Command followed by DTERDIS
"#" ANK # O LU MNA DDRE S S
72 72 )4 %
$4 $ $ 4 %2 $ )3
$ $ A TA TO " # X
#O M # OM M AND
!D D R! D DRE SS"#
7,7 RITE , ATEN C Y
#, #! 3 ,A TE N CY
$% 3 $ ES E LE CT
.$ ./ 0O R$E S ELE CT
$O NgT# A RE
$A TA 4 ERM INA TION /FF
1. Write shown with nominal value of tDQSS.
2. WDQS can only transition when data is applied at the chip input and during pre- and postambles
3. A margin of one clock has been introduced in order to make sure that the data termination are still on when
the last Write data reaches the memory.
4. The minimum distance between Write and DTERDIS is (WL -CL + 4) clocks and always bigger than or equal
to 1. For (CL=6 / WL=2) and (CL=7 / WL=3) as well as for (CL=7 / WL=2) the minimum distance between Write
and DTERDIS is set to 1 clock. Please refer to table below:
Table 24 WL / CL
WL \ CL
5
6
7
2
1
1
1
3
2
1
1
4
3
2
1
Data Sheet
43
Rev. 1.11, 04-2005
10292004-DOXT-FS0U