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TLE8209-2SA Datasheet, PDF (36/38 Pages) Infineon Technologies AG – SPI Programmable H-Bridge
TLE8209-2SA
11
Package Outlines TLE8209-2SA
Package Outlines TLE8209-2SA
1.1 ±0.1
11 ±0.15 1)
B
2.8
1.27
0.4 +0.13
15.74 ±0.1
(Heatslug)
0.1
0.25 M A 20x
20
11
Index Marking
6.3
(Mold)
14.2 ±0.3
Heatslug
0.95 ±0.15
0.25 B
Bottom View
11
20
1 x 45˚ 1
10
15.9 ±0.15 1)
A
(Mold)
10 13.7 -0.2 1
(Metal)
1) Does not include plastic or metal protrusion of 0.15 max. per side
Heatslug
Footprint:
0.68
GPS05791
1.27
9 x 1.27 = 11.43
hlg09550
Figure 21 PG-DSO-20-65 (Plastic Dual Small Outline Package)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page: http://www.infineon.com/packages
Data Sheet
36
Dimensions in mm
Rev. 1.0, 2010-02-16