HYS72T32000GR Datasheet, PDF (23/24 Pages) Infineon Technologies AG – DDR2 Registered DIMM Modules

HYS72Txx0xxGR
Registered DDR2 SDRAM-Modules
8.0 Nomenclature (Modules & Components)
8.1 DDR2 DIMM Modules
1 2 3 4 5 6 7 8 9 10 11
Example: ^{H Y S 6 4 T 6 4 0 2 0 G R - 5 -A}
1 INFINEON Prefix
2 Module Data Width
3 DRAM Technology
HYS for DIMM Modules
64 = Non-ECC Modules
72 = ECC Modules
T = DDR2
32 = 32 Mb
4
Memory Density per I/O
64 = 64 Mb
128 = 128 Mb
256 = 256 Mb
5 Raw Card Generation 0 = first generation
6
Number of Memory
Ranks
0 = One Rank
2 = Two Ranks
7 Product Variations
8 Package
0 = standard
2 = dual die package
G= BGA components
9 Module Type
R = Registered DIMMs
U = Unbuffered DIMMs
DL = Small Outline DIMMs
10 Speed Grade
-5 = PC2-3200 (DDR2-400)
-3.7 = PC2-4200 (DDR2-533)
-3 = PC2-5300 (DDR2-667)
11 Die Revision
A = 1st Generation
B = 2nd Generation
C = 3rd Generation
Multiplying “Memory Density per I/O” with “Module Data Width”
and dividing by 8 for Non-ECC and 9 for ECC modules gives the
overall module memory density in MBytes.
8.2 DDR2 Memory Components
1 2 34 5 6 7 8 9
Example: ^{H Y B 1 8 T 2 5 6 4 0 0 A C - 5}
1
INFINEON
Component Prefix
HYB for DRAM Components 6 Product Variations
2 Power Supply Voltage 18 = 1.8 V Power Supply
7 Die Revision
3 DRAM Technology
4 Memory Density
5 Memory Organisation
T = DDR2
256 = 256 Mb
512 = 512 Mb
1G = 1024Mb
40 = x4, 4 data in/outputs
80 = x8, 8 data in/outputs
16 = x16, 16 data in/outputs
8 Package Type
9 Speed Grade
0 = standard
A = 1st Generation
B = 2nd Generation
C = 3rd Generation
C = BGA package
F = BGA package (lead and
halogen free)
-5 =...DDR2-400
-3.7 =.DDR2-533
-3 =...DDR2-667
INFINEON Technologies
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