HYS64D64300GU Datasheet, PDF (20/40 Pages) Infineon Technologies AG – 184-Pin Unbuffered Dual-In-Line Memory Modules

HYS[64/72]D[64300/128320][G/H]U–[5/6]–B
Unbuffered DDR SDRAM Modules
Electrical Characteristics
Table 13 AC Timing - Absolute Specifications for PC3200 and PC2700
Parameter
Symbol –5
DDR400B
–6
DDR333
Unit
Note/ Test
Condition ¹⁾
Active bank A to Active bank B
command
t_RRD
Write recovery time
t_WR
Auto precharge write recovery +
t_DAL
precharge time
Internal write to read command delay t_WTR
Exit self-refresh to non-read command t_XSNR
Exit self-refresh to read command
t_XSRD
Average Periodic Refresh Interval
t_REFI
Min. Max. Min. Max.
10
—
12
—
ns
15
—
15
—
ns
t_CK
2
—
1
—
t_CK
75
—
75
—
ns
200 —
200 —
t_CK
—
7.8
—
7.8
µs
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2)3)4)5)
2)3)4)5)12)
1) 0 °C ≤ T_A ≤ 70 °C; V_DDQ = 2.5 V ± 0.2 V, V_DD = +2.5 V ± 0.2 V (DDR333); V_DDQ = 2.6 V ± 0.1 V, V_DD = +2.6 V ± 0.1 V
(DDR400)
2) Input slew rate ≥ 1 V/ns for DDR400, DDR333
3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference
level for signals other than CK/CK, is V_REF. CK/CK slew rate are ≥ 1.0 V/ns.
4) Inputs are not recognized as valid until V_REF stabilizes.
5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is V_TT.
6) These parameters guarantee device timing, but they are not necessarily tested on each device.
7) t_HZ and t_LZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred
to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
8) The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge.
A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were
previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress,
DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on t_DQSS.
9) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but
system performance (bus turnaround) degrades accordingly.
10) Fast slew rate ≥ 1.0 V/ns , slow slew rate ≥ 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/
ns, measured between V_IH(ac) and V_IL(ac).
11) For each of the terms, if not already an integer, round to the next highest integer. t_CK is equal to the actual system clock
cycle time.
12) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device.
Data Sheet
20
Rev. 1.0, 2004-05
10042003-RYU3-RQON