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PTAB182002FC Datasheet, PDF (2/13 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FET
PTAB182002FC
DC Characteristics
Characteristic
Conditions
Symbol
Min
Typ
Max Unit
Drain-source Breakdown Voltage
VGS = 0 V, IDS = 10 mA
V(BR)DSS
65
—
—
V
Drain Leakage Current
VDS = 28 V, VGS = 0 V
IDSS
—
—
1.0
µA
VDS = 63 V, VGS = 0 V
IDSS
—
—
10.0
µA
On-state Resistance (main)
VGS = 10 V, VDS = 0.1 V
RDS(on)
—
0.15
—
W
On-state Resistance (peak)
VGS = 10 V, VDS = 0.1 V
RDS(on)
—
0.09
—
W
Operating Gate Voltage (main)
VDS = 28 V, IDQ = 520 mA
VGS
2.5
3.0
3.5
V
Operating Gate Voltage (peak)
VDS = 28 V, IDQ = 0 mA
VGS
0.7
1.1
1.5
V
Gate Leakage Current
VGS = 10 V, VDS = 0 V
IGSS
—
—
1.0
µA
Maximum Ratings
Parameter
Symbol
Drain-source Voltage
VDSS
Gate-source Voltage
VGS
Junction Temperature
TJ
Storage Temperature Range
TSTG
Thermal Resistance (main, TCASE = 70°C, 80 W CW class AB) RqJC
Thermal Resistance (peak, TCASE = 70°C, 110 W CW class C) RqJC
Value
65
–6 to +10
200
–40 to +150
0.86
0.64
Unit
V
V
°C
°C
°C/W
°C/W
Ordering Information
Type and Version
PTAB182002FC V1 R0
PTAB182002FC V1 R250
Order Code
Package and Description Shipping
PTAB182002FCV1R0XTMA1 H-37248-4, ceramic open-cavity, earless flange
Tape & Reel, 50 pcs
PTAB182002FCV1R250XTMA1 H-37248-4, ceramic open-cavity, earless flange
Tape & Reel, 250 pcs
Data Sheet
2 of 13
Rev. 04.1, 2016-06-09