TLE5011_11 Datasheet, PDF (15/45 Pages) Infineon Technologies AG – GMR Angle Sensor

TLE5011
Specification
Note: The thermal resistances listed in Table 21 “Package Parameters” on Page 42 must be used to calculate
the corresponding ambient temperature.
Calculation of the Junction Temperature
The total power dissipation P_TOT of the chip increases its temperature above the ambient temperature.
The power multiplied by the total thermal resistance R_thJA (Junction to Ambient) leads to the final junction temperature. R_thJA
is the sum of the addition of the values of the two components Junction to Case and Case to Ambient.
R_thJA = R_thJC + R_thCA
T_J = T_A + ΔT
ΔT = R_thJA x P_TOT = R_thJA x ( V_DD x I_DD + V_OUT x I_OUT )
I_DD , I_OUT > 0, if direction is into IC
Example (assuming no load on Vout):
– V_DD = 5 V
– I_DD = 15 mA
– ΔT =150 [K/W] x (5 [V] x 0.015 [A] + 0 [VA] ) =11.25 K
For moulded sensors, the calculation with R_thJC is more adequate.
3.4
Characteristics
3.4.1 Electrical Parameters
The indicated electrical parameters apply to the full operating range, unless otherwise specified. The typical values
correspond to a supply voltage V_DD = 5.0 V and 25°C, unless individually specified. All other values correspond to
- 40°C < T_J < 150°C.
Table 4 Electrical Parameters
Parameter
Symbol Limit Values
Supply Current ¹⁾
I_DD
min.
typ.
-
15
-
-
POR Level
V_POR
2.0
2.3
POR Hysteresis
V_PORhy
-
30
Power-On Time
t_Pon
50
100
PLL Jitter
t_{PLLjit_S}
-
1.3
t_{PLLjit_L}
3.0
ADC Noise ⁵⁾
N_ADC
-
1
-
2
max.
20
21
2.9
-
200
2.0 ²⁾
3.9
2.2
4.4²⁾
Unit Notes
mA
V
mV
µs
ns
digits
V_DD = 3.0 to 5.5V
V_DD = 6.5 V
Power-On Reset
V_DD > V_DDmin & after first
edge on f_CLK
short term ³⁾
long term ⁴⁾
1 σ @ FIR_BYP = 0
1 σ @ FIR_BYP = 1
Final Data Sheet
15
V2.0, 2011-03