XC228X Datasheet, PDF (106/110 Pages) Infineon Technologies AG – 16/32-Bit Single-Chip Microcontroller with 32-Bit Performance

XC2287 / XC2286 / XC2285
XC2000 Family Derivatives
Preliminary
Package and Reliability
5
Package and Reliability
In addition to the electrical parameters, the following information ensures proper
integration of the XC228x into the target system.
5.1
Packaging
These parameters describe the housing rather than the silicon.
Table 26 Package Parameters (PG-LQFP-144)
Parameter
Symbol
Limit Values Unit Notes
Min.
Max.
Exposed Pad Dimension Ex × Ey –
6.5 × 6.5 mm –
Power Dissipation
Thermal resistance
Junction-Ambient
P_DISS
–
R_ΘJA
–
1.0
W
–
45
K/W No thermal via¹⁾
36
K/W 4-layer, no pad²⁾
22
K/W 4-layer, pad³⁾
1) Device mounted on a 2-layer or 4-layer board without thermal vias.
2) Device mounted on a 4-layer board with thermal vias, exposed pad not soldered.
3) Device mounted on a 4-layer board with thermal vias, exposed pad soldered to the board.
Data Sheet
104
V0.91, 2007-02
Draft Version