H1A424M167 Datasheet, PDF (47/47 Pages) Hynix Semiconductor – Image Signal Processor for Hyundai CMOS Image Sensor

Hyundai Electronics Industries Co., Ltd.
H1A424M167
11. SOLDERING
11.1. Solder reflow equipment
11.1.1. (Preferred)100% Convection reflow system capable of maintaining the
reflow profiles required by EIA/JEDEC standard(JESD22-A113-B).
11.1.2. VPR(Vapor Phase Reflow) chamber capable of operating from 215 °C -
219 °C and/or (235±5) °C with appropriate fluids.
11.1.3. Infrared(IR)/Convection solder reflow equipment capable of maintaining
the reflow profiles required by EIA/JEDEC standard(JESD22-A113-B).
11.2. Reflow Profiles
Average ramp-up rate(183 °C to Peak)
Preheat temperature 125(±25) °C
Temperature maintained above 183 °C
Time within 5 °C of actual peak temperature
Peak temperature range
Ramp-down rate
Time 25 °C to peak temperature
Convection or IR/Convection
3 °C/second max.
120 second max.
60-150 seconds
10-20 seconds
(220+5/-0) °C or (235+5/-0) °C
6 °C/second max.
6 minutes max.
VPR
10 °C/second max.
60 seconds
215-219 °C or (235+5/-0) °C
10 °C/second max.
11.3. Flux application
After the reflow solder cycles are completed, allow the devices to cool at room ambient
for 15 minutes minimum. Apply an activated water soluble flux to the device leads by
bulk immersion of the entire parts in flux at room ambient for 10 seconds minimum.
11.4. Cleaning
Clean devices externally using multiple agitated deionized water rinses. No waiting time
is required between flux application and cleaning
11.5. Drying
Devices should be dried at room ambient prior to submission to reliability testing.
1999 October 11
Page 47