HY29LV800 Datasheet, PDF (38/40 Pages) Hynix Semiconductor – 8 Mbit (1M x 8/512K x 16) Low Voltage Flash Memory

HY29LV800
ORDERING INFORMATION
Hynix products are available in several speeds, packages and operating temperature ranges. The
ordering part number is formed by combining a number of fields, as indicated below. Refer to the ‘Valid
Combinations’ table, which lists the configurations that are planned to be supported in volume. Please
contact your local Hynix representative or distributor to confirm current availability of specific configura-
tions and to determine if additional configurations have been released.
HY29LV800 X X - X X X
SPECIAL INSTRUCTIONS
TEMPERATURE RANGE
Blank = Commercial ( 0 to +70 °C)
I = Industrial (-40 to +85 °C)
SPEED OPTION
55 = 55 ns
70 = 70 ns
90 = 90 ns
PACKAGE TYPE
T = 48-Pin Thin Small Outline Package (TSOP)
F = 48-Ball Fine-Pitch Ball Grid Array (FBGA), 8 x 9 mm
G = 44-Pin Plastic Small Outline Package (PSOP)
BOOT BLOCK LOCATION
T = Top Boot Block Option
B = Bottom Boot Block Option
DEVICE NUMBER
HY29LV800 = 8 Megabit (1M x 8/512K x 16) CMOS 3 Volt-Only
Sector Erase Flash Memory
VALID COMBINATIONS
Package and Speed
TSOP
PSOP ²
FBGA
Temperature 55 ns 70 ns 90 ns 55 ns 70 ns 90 ns 55 ns 70 ns 90 ns
Commercial
T-55 T-70 T-90 G-55 G-70 G-90 F55 F-70 F-90
Industrial
T-55I T-70I T-90I G-55I G-70I G-90I F-55I F-70I F-90I
Note:
1. The complete part number is formed by appending the suffix shown in the table above to the Device Number. For
example, the part number for a 90 ns, top boot block, Industrial temperature range device in the TSOP package is
HY29LV800TT-90I.
2. Contact your Hynix sales representative or authorized distributor to determine availability of this package version.
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Rev. 1.0/Nov. 01