HYMD116M725B8-J Datasheet, PDF (19/19 Pages) Hynix Semiconductor – Unbuffered DDR SDRAM SO-DIMM

HYMD116M725B(L)8-J/M/K/H/L
SERIAL PRESENCE DETECT
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Byte#
Function Description
72 Manufacturing location
73 Manufacture part number(Hynix Memory Module)
74 ----- Manufacture part number(Hynix Memory Module)
75 ----- Manufacture part number(Hynix Memory Module)
76 Manufacture part number (DDR SDRAM)
77 Manufacture part number(Memory density)
78 Manufacture part number(Module Depth)
79 ------- Manufacture part number(Module Depth)
80 Manufacture part number(Module type)
81 Manufacture part number(Data width)
82 -------Manufacture part number(Data width)
83 Manufacture part number(Refresh, # of Bank.)
84 Manufacture part number(Component Generation)
85 Manufacture part number(Component Configuration)
86 Manufacture part number(Hyphen)
87 Manufacture part number(Minimum cycle time)
88~90 Manufacture part number(T.B.D)
91 Manufacture revision code(for Component)
92 Manufacture revision code (for PCB)
93 Manufacturing date(Year)
94 Manufacturing date(Week)
95~98 Module serial number
99~127 Manufacturer specific data (may be used in future)
128~255 Open for customer use
Function Supported
J
M
K
H
L
Hynix(Korea Area)
HSA(United States Area)
HSE(Europe Area)
HSJ(Japan Area)
Singapore
Asia Area
H
Y
M
D
1
1
6
M
7
2
5(4K refresh,4Bank)
B
8
‘-’
J
M
K
H
L
-
-
-
-
-
-
Undefined
Undefined
Hexa Value
Note
JMKH L
0*h
1*h
2*h
3*h
6
4*h
5*h
48h
59h
4Dh
44h
31h
31h
36h
4Dh
37h
32h
35h
42h
38h
2Dh
4Ah 4Dh 4Bh 48h 4Ch
20h
-
-
-
3
-
3
-
4
00h
5
00h
5
Note :
1. The bank address is excluded
2. These value is based on the component specification
3. These bytes are programmed by code of date week & date year
4. These bytes apply to Hynix’s own Module Serial Number system
5. These bytes undefined and coded as ‘00h’
6. Refer to Hynix web site
Byte 85~86, Low power part
Byte#
Function Description
Function Supported
JMKH L
Hexa Value
J MK H
Note
L
85 Manufacture part number(Low power part)
L
4Ch
86 Manufacture part number(Component Configuration)
8
38h
Rev. 0.2/Aug. 02
19