HDMP-1637A Datasheet, PDF (9/16 Pages) Agilent(Hewlett-Packard) – Gigabit Ethernet SerDes Circuit with Differential PECL Clock Inputs

9
HDMP-1637A (Transmitter Section)
Output Jitter Characteristics (measured with equivalent parts which have TTL REFCLK input)
T_A = 0°C to +70°C, V_CC = 3.15 V to 3.45 V
Symbol
Parameter
Units Typ.
RJ^[1]
Random Jitter at DOUT, the High Speed Electrical Data Port, specified as
ps
8
1 sigma deviation of the 50% crossing point (RMS)
DJ^[1] Deterministic Jitter at DOUT, the High Speed Electrical Data Port (pk-pk)
ps
25
Note: 1. Defined by Fibre Channel Specification X3.230-1994 FC-PH Standard, Annex A, Section A.4 and tested using measurement
method shown in Figure 8.
70841B
PATTERN
GENERATOR*
0000011111
+ DATA
- DATA
125 MHz
1.25 GHz
70311A
CLOCK SOURCE
* PATTERN
GENERATOR
PROVIDES A
DIVIDE BY
10 FUNCTION.
PECL
83480A
OSCILLOSCOPE
TRIGGER
CH1 CH2
+DOUT -DOUT
HDMP-1637A
REFCLK LOOPEN
Txi[0..9]
0011111000
(STATIC K28.7)
A. BLOCK DIAGRAM OF RJ MEASUREMENT METHOD
Figure 8. Transmitter Jitter Measurement Method.
70311A
CLOCK SOURCE
DIVIDE
BY 10
CIRCUIT
(DUAL
OUTPUT)
1.25 GHz
DIVIDE
BY 2
70841B
PATTERN
GENERATOR
+K28.5, -K28.5
+ DATA
- DATA
83480A
OSCILLOSCOPE
TRIGGER
CH1 CH2
VARIABLE
DELAY
PECL
125 MHz
+DOUT -DOUTi
-DIN
+DIN
HDMP-1637A
REFCLK
ENBYTSYNC
LOOPEN
Txi[0..9] Rx[0..9]
B. BLOCK DIAGRAM OF DJ MEASUREMENT METHOD
HDMP-1637A (TRx)
Thermal and Power Temperature Characteristics
T_A = 0°C to +70°C, V_CC = 3.15 V to 3.45 V
Symbol
Parameter
P_D,TRx[1,2]
Transceiver Power Dissipation, Outputs connected per
recommended bias terminations with idle pattern
Θ_jc[3]
Thermal Resistance, Junction to Case
Units
mW
°C/W
Typ.
620
Max.
900
11
Notes:
1. P_D is obtained by multiplying V_CC by I_CC and subtracting the power dissipated outside the chip at the high speed bias resistors.
2. Specified with high speed outputs biased with 150 Ω resistors and receiver TTL outputs driving 10 pF loads.
3. Based on independent package testing by Agilent Technologies. Θ_ja for these devices is 56.1°C/W for the HDMP-1637A. Θ_ja is
measured on a standard 3x3" FR4 PCB in a still air environment. To determine the actual junction temperature in a given
application, use the following: T_j = T_C + (Θ_jc x P_D), where T_C is the case temperature measured on the top center of the package
and P_D is the power being dissipated.