HDMP-1637A Datasheet, PDF (11/16 Pages) Agilent(Hewlett-Packard) – Gigabit Ethernet SerDes Circuit with Differential PECL Clock Inputs

11
*GND
TX[0]
TX[1]
TX[2]
*V_CC
TX[3]
TX[4]
TX[5]
TX[6]
*V_CC
TX[7]
TX[8]
TX[9]
*GND
GND_TXA
TXCAP1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
48
2
47
3
46
4
45
5
44
6
43
7
8
HDMP-1637A
42
41
9
xxxx-x Rz.zz
40
10
39
11
S YYWW
38
12
37
13
36
14
35
15
34
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
RXCAP0
BYTSYNC
GND_RXTTL
RX[0]
RX[1]
RX[2]
V_CC_RXTTL
RX[3]
RX[4]
RX[5]
RX[6]
V_CC_RXTTL
RX[7]
RX[8]
RX[9]
GND_RXTTL
xxxx-x = WAFER LOT NUMBER–BUILD NUMBER
Rz.zz = DIE REVISION
S = SUPPLIER CODE
YYWW = DATE CODE (YY = YEAR, WW = WORK WEEK)
COUNTRY = COUNTRY OF MANUFACTURE
(MARKED ON BACK OF DEVICE)
*N/C: THIS PIN IS CONNECTED TO AN ISOLATED PAD AND HAS NO FUNCTIONALITY.
IT CAN BE LEFT OPEN, HOWEVER, TTL LEVELS CAN ALSO BE APPLIED TO THIS PIN.
*V_CC: THIS PIN IS BONDED TO AN ISOLATED PAD AND HAS NO FUNCTIONALITY.
HOWEVER, IT IS RECOMMENDED THAT THIS PIN BE CONNECTED TO V_CC IN ORDER
TO CONFORM WITH THE X3T11 "10-BIT SPECIFICATION," AND TO HELP DISSIPATE HEAT.
*GND: THIS PIN IS BONDED TO AN ISOLATED PAD AND HAS NO FUNCTIONALITY.
HOWEVER, IT IS RECOMMENDED THAT THIS PIN BE CONNECTED TO GND IN ORDER TO
CONFORM WITH THE X3T11 "10-BIT SPECIFICATION," AND TO HELP DISSIPATE HEAT.
HDMP-1637 fig 11
Figure 11. HDMP-1637A (TRx) Package Layout and Marking, Top View.