HCPL-810J Datasheet, PDF (4/16 Pages) Agilent(Hewlett-Packard) – PLC Powerline DAA IC

Package Characteristics
All specifications and figures are at the nominal (typical) operating conditions of V_CC1 = 5 V, GND1 = 0 V, V_CC2 = 5 V, GND2 =
0 V and T_A = +25°C.
Parameter
Symbol Min.
Control IC − Line IC Momentary
Withstand Voltage
V_ISO
3750
Resistance (Control IC − Line IC)
R_I-O
Capacitance (Control IC – Line IC)
C_I-O
Control IC to Ambient Thermal Resistance θ_IA
Line IC to Ambient Thermal Resistance θ_OA
Typ.
>10⁹
1.4
83
85
Max.
Units Test Conditions
Note
V_rms RH< 50%, t = 1 min., 1, 2, 3
T_A = 25°C
Ω
V_I-O = 500 V_dc
3
pF f = 1 MHz
°C/W 1 oz. trace, 2-layer 4
PCB, Still air, T_A = 25°C
Notes:
1. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 Vrms for 1 second (leakage detection current
limit, I_I-O ≤ 5 µA). This test is performed before the 100% production test for partial discharge (method b) shown in IEC/EN/DIN EN 60747-5-2 Insulation
Characteristics Table, if applicable.
2. The Control IC-Line IC Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as a Control IC-Line IC continuous
voltage rating. For the continuous voltage rating refer to your equipment level safety specification or IEC/EN/DIN EN 60747-5-2 Insulation
Characteristics Table.
3. Device is considered as a two terminal device: pins 1 - 8 shorted together and pins 9 - 16 shorted together.
4. Maximum power dissipation in Control side and Line side IC's needs to be limited to ensure that their respective junction temperature is less than 125°C.
The maximum permissible power dissipation is dependent on the thermal impedance and the ambient temperature. Details on the typical thermal
impedances are given in the Package Characteristics. Further details on applying this to an actual application can be found in the Application Information
section under Thermal Considerations.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3˚C + 1˚C/–0.5˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.
PEAK
TEMP.
245˚C
200
160˚C
150˚C
140˚C
100
2.5˚C ± 0.5˚C/SEC.
3˚C + 1˚C/–0.5˚C
PREHEATING TIME
150˚C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240˚C
SOLDERING
TIME
200˚C
PEAK
TEMP.
230˚C
50 SEC.
TIGHT
TYPICAL
LOOSE
0
0
50
100
150
200
250
ROOM
TEMPERATURE
TIME (SECONDS)
4