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MB82DP02183C-65L Datasheet, PDF (30/32 Pages) Fujitsu Component Limited. – 32M Bit (2 M word × 16 bit) Mobile Phone Application Specific Memory
MB82DP02183C-65L
■ BONDING PAD INFORMATION
Please contact local FUJITSU representative for pad layout and pad coordinate information.
■ ORDERING INFORMATION
Part Number
MB82DP02183C-65LWT
MB82DP02183C-65LPBT
Shipping Form / Package
Wafer
71-ball plastic FBGA
(BGA-71P-M03)
Remarks
30