DS_FT313H Datasheet, PDF (60/64 Pages) Future Technology Devices International Ltd. – The FT313H is a Hi-Speed Universal Serial Bus (USB) Host Controller compatible with Universal Serial Bus Specification Rev 2.0 and supports data transfer speeds of up to 480M bit/s.

Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.1
Clearance No.: FTDI# 318
8.4 Solder Reflow Profile
The FT313H is supplied in Pb free QFN-64, LQFP-64 and TQFP-64 packages. The recommended solder
reflow profile for all package options is shown in Figure 8-4.
T_p
T_L
T_S Max
T_S Min
Ramp Up
t_S
Preheat
t_p
t_L
Critical Zone: when
T is in the range
T_L to Tp
Ramp
Down
25
T = 25º C to T_P
Time, t (seconds)
Figure 8-4 FT313H Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 8-1. Values are shown for
both a completely Pb free solder process (i.e. the FT313H is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT313H is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
Time Maintained Above Critical Temperature
TL:
- Temperature (TL)
- Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak Temperature
(tp)
Ramp Down Rate
Time for T= 25°C to Peak Temperature, Tp
Table 8-1 Reflow Profile Parameter Values
150°C
200°C
60 to 120 seconds
217°C
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second Max.
8 minutes Max.
100°C
150°C
60 to 120 seconds
183°C
60 to 150 seconds
240°C
20 to 40 seconds
6°C / second Max.
6 minutes Max.
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